美国商务部全面封锁华为购买采用美国技术的芯片

美国商务部当地时间5月15日发布声明称，全面限制华为购买采用美国软件和技术生产的半导体，包括那些处于美国以外，但被列为美国商务管制清单中的生产设备，要为华为和海思生产代工前，都需要获得美国政府的许可证。由于考虑到该措施会对于晶圆代工厂带来巨大的经济影响，因此给予120天的缓冲期，以降低该规定变更带来的冲击。

受此消息影响，美国芯片股集体大跌。新飞通光电跌逾12%，高通跌超5%，美光科技跌2.89%，台积电跌超4%。

以下是美国商务部工业和安全局声明全文：

The Bureau of Industry and Security （BIS） today announced plans to protect U.S. national security by restricting Huawei’s ability to use U.S. technology and software to design and manufacture its semiconductors abroad. This announcement cuts off Huawei’s efforts to undermine U.S. export controls. BIS is amending its longstanding foreign-produced direct product rule and the Entity List to narrowly and strategically target Huawei’s acquisition of semiconductors that are the direct product of certain U.S. software and technology.

Since 2019 when BIS added Huawei Technologies and 114 of its overseas-related affiliates to the Entity List， companies wishing to export U.S. items were required to obtain a license.^[1]However， Huawei has continued to use U.S. software and technology to design semiconductors， undermining the national security and foreign policy purposes of the Entity List by commissioning their production in overseas foundries using U.S. equipment.

“Despite the Entity List actions the Department took last year， Huawei and its foreign affiliates have stePPed-up efforts to undermine these national security-based restrictions through an indigenization effort.However， that effort is still dependent on U.S. technologies，” said Secretary of Commerce Wilbur Ross.“This is not how a responsible global corporate citizen behaves.We must amend our rules exploited by Huawei and HiSilicon and prevent U.S. technologies from enabling malign activities contrary to U.S. national security and foreign policy interests.”

Specifically， this targeted rule change will make the following foreign-produced items subject to the Export Administration Regulations （EAR）:

（i）Items， such as semiconductor designs，when produced by Huawei and its affiliates on the Entity List（e.g.， HiSilicon）， that are the direct product of certain U.S. Commerce Control List （CCL） software and technology； and

（ii）Items， such as chipsets，when produced from the design specifications of Huawei or an affiliate on the Entity List（e.g.， HiSilicon）， that are the direct product of certain CCL semiconductor manufacturing equipment located outside the United States.Such foreign-produced items will only require a license when there is knowledge that they are destined for reexport， export from abroad， or transfer （in-country） to Huawei or any of its affiliates on the Entity List.

To prevent immediate adverse economic impacts on foreign foundries utilizing U.S. semiconductor manufacturing equipment that have initiated any production step for items based on Huawei design specifications as of May 15, 2020, such foreign-produced items are not subject to these new licensing requirements so long as they are reexported， exported from abroad， or transferred （in-country） by 120 days from the effective date.

Federal Register notice of the interim final rule isavailable here.

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